So you have really cheap microelectronics, those microelectronic power drones.
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The groom, also 37, is a general manager for microTEC, a company based in Duisburg, Germany, that provides three-dimensional printing for microstructures and microelectronic systems.
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"As microelectronic technology continues to evolve, microprocessors are becoming more complex and in all likelihood will generate more heat and increase thermal strains in electronic and circuit solder joints," the patent stated.
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Olhoeft has a brain implant, tiny bits of microelectronic circuitry that deliver electrical impulses to his motor cortex in order to control the debilitating tremors he suffers as a symptom of Parkinson's disease.
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Micron shares fell as much as 8 percent during regular trading on Tuesday after Taiwanese rival United Microelectronic Corporation (UMC) released a statement claiming a Chinese court had temporarily banned sales of Micron chips in China.
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Mr. Bloch's role was to oversee the development of Solid Logic Technology — half-inch ceramic modules for the microelectronic circuitry that provided the System/360 with superior power, speed and memory, all of which would become fundamental to computing.
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"The potential for direct data exchange between human neural networks and microelectronic systems could revolutionize tactical warfighter communications, speed the transfer of knowledge throughout the chain of command, and ultimately dispel the &aposfog&apos of war," the study explains.
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Dan Green, the program manager, had more winged words to utter for CHIPS: "Now we are moving beyond pretty pictures and mere words, and we are rolling up our sleeves to do the hard work it will take to change the way we think about, design, and build our microelectronic systems."
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EM Microelectronic design and develop Bluetooth Low Energy products such as the EM9301.EM Microelectronic EM9301 EM is an associate member of the Bluetooth SIG and is contributing through several working group to improve global specification and expertise in ultra- low power design for Bluetooth low energy wireless technology.EM Microelectronic-Marin corporate website EM Micro has also a proprietary link family of products with 1Mbits, 2Mbit/s and Long range solutions.
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Microelectronic trophy from EUROASIC for a joint project with Roland Moreno, the inventor of the Smart card.
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In microelectronic fabrication, solid solubility refers to the maximum concentration of impurities one can place into the substrate.
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Single-crystal silicon is used to manufacture most Si-based microelectronic devices. Polycrystalline silicon can be as much as 99.9999% pure. Ultra-pure poly is used in the semiconductor industry, starting from poly rods that are two to three meters in length. In microelectronic industry (semiconductor industry), poly is used both at the macroscale and microscale (component) level.
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Center for Biomimetic MicroElectronic Systems is on the campus of the University of Southern California. The Biomimetic MicroElectronic Systems (BMES) vision is realized first by identifying the unmet medical needs in the 3 testbeds of blindness, paralysis, and central nervous system impairments. The solutions to these needs are then developed by designing and synthesizing engineered system specifications from medical, scientific, and engineering disciplines. Furthermore, to develop these novel biomimetic microelectronic systems, our BMES ERC's work is concentrated in three thrust areas of enabling technology that are at the heart of immediate and long-term interest to the rapidly growing medical device industry.
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Nanoscale dispensing in liquid environment of streptavidin on a biotin-functionalized surface using hollow atomic force microscopy probes. Microelectronic Engineering, 86( 4-6), 1481 – 1484.
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Many components of normal electronic design are available in a microelectronic equivalent. These include transistors, capacitors, inductors, resistors, diodes and (naturally) insulators and conductors can all be found in microelectronic devices. Unique wiring techniques such as wire bonding are also often used in microelectronics because of the unusually small size of the components, leads and pads. This technique requires specialized equipment and is expensive.
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Aeroflex consisted of Aeroflex Microelectronic Solutions (AMS), a fabless manufacturer of rad-hard and high reliability semiconductor devices, and Aeroflex Test Solutions (ATS), which produced electronic test equipment.
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Rolf Alfons Aschenbrenner from the Fraunhofer IZM, Berlin, Germany was named Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013 for contributions to microelectronic packaging.
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In terms of Automotive, CISC offers various tools and services related to microelectronic engineering work, assisting in development work by providing know-how and tools to support design engineers.
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VEB Halbleiterwerk was succeeded, in turn, by Halbleiterwerk GmbH, System Microelectronic Innovation GmbH (SMI), Silicon Microelectronic Integration GmbH (SiMI), Megaxess GmbH Deutschland, and Microtechnology Services Frankfurt (Oder) GmbH (MSF), each with less employees than its predecessor. The website of MSF disappeared around 2009. Construction on a new semiconductor plant, Communicant Semiconductor Technologies, had started already but this endeavour collapsed in 2003. Only IHP, the research institute that had supported VEB Halbleiterwerk, remained after that.
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Within the business unit Tools+Methodology, CISC works on system design, modeling, simulation, verification and optimization of heterogeneous embedded microelectronic systems, as well as software engineering e.g. for the EDA industry.
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The university was the first university to offer a bachelor's degree in Microelectronic Engineering. The Center's facilities include 50,000 square feet (4,600 m2) of building space with 10,000 square feet (930 m2) of clean room space; the building will undergo an expansion later this year. Its research programs include nano-imaging, nano-lithography, nano-power, micro- optical devices, photonics subsystems integration, high-fidelity modeling and heterogeneous simulation, microelectronic manufacturing, microsystems integration, and micro-optical networks for computational applications.
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Originally, microelectronic devices were manufactured by companies that both designed and produced the devices. This was necessary because manufacturing involved tweaking parameters, precise understanding of the manufacturing processes being used, and the occasional need to redesign. These manufacturers were involved in both the research and development of manufacturing processes and the research and development of microcircuit design. However, as manufacturing techniques developed, microelectronic devices became more standardised allowing them to be used by more than a single manufacturer.
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"Tests developed to examine the effect of atmospheric neutrons on microelectronic circuits in aircraft". Retrieved 22 May 2013.Yoshida, Junko (25 September 2006). "Alpine lab enters rarified air of soft-error test".
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Ed. MIET, Moscow, 1986, (in Russian). # Physical fundamentals of microelectronic devices. Ed. MIET, Moscow, 1987, (in Russian). # Mathematical modeling of physical processes in the microchip elements. Ed. MIET, Moscow, 1988, (in Russian).
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T. H. P. Chang et al., Microelectronic Engineering 57-58, pp. 117-135 (2001). The goal is to use the parallel scanning of the beams to speed up the patterning of large areas.
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Such connections have reinforced the research portfolio, expertise, and graduate reputation of the imaging researchers and staff of the department. As of 2008, imaging-related research has the largest budget at the university from grants and independent research. The Microelectronic Engineering program, created in 1982 and the only ABET-accredited undergraduate program in the country,"25 Years of Microelectronic Engineering Education", Santosh K. Kurinec, et al., 16th Biennial University Government Industry Microelectronics Symposium Proceedings, San Jose State University, San Jose, CA, June 2006.
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Sedra; Smith. "Microelectronic Circuits". 2015. Section "Emitter-Coupled Logic (ECL)". p. 47. Radiation hardening: While normal commercial-grade chips can withstand 100 gray (10 krad), many ECL devices are operational after 100,000 Gray (10 Mrad).
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Mercury has redundant, scalable Advanced Microelectronic Centers (AMCs). AMCs are for the production of defense industry subsystems. AMCs are operated in New England, New York Metro-area, Southern California and a facility in the Southwest.
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A. Hierlemann, U. Frey, S. Hafizovic, F. Heer (2011). Growing Cells atop Microelectronic Chips: Interfacing Electrogenic Cells in Vitro with CMOS- based Microelectrode Arrays. Proceedings of the IEEE, Vol. 99, No. 2, pp. 252-284.
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Together with TU Dresden, VEB ZFTM and VEB Spurenmetalle formed the foundation for Silicon Saxony, a cluster of microelectronics companies that came to include new fabs by Siemens (later Infineon Technologies) and AMD (later GlobalFoundries). The Frankfurt (Oder) region did not fare as well. VEB Halbleiterwerk was succeeded, in turn, by Halbleiterwerk GmbH, System Microelectronic Innovation GmbH (SMI), Silicon Microelectronic Integration GmbH (SiMI), Megaxess GmbH Deutschland, and Microtechnology Services Frankfurt (Oder) GmbH (MSF), each with less employees than its predecessor. The website of MSF disappeared around 2009.
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An optical switch can operate by mechanical means or by electro-optic effects, magneto-optic effects as well as by other methods. Optical switches are optoelectronic devices which can be integrated with integrated or discrete microelectronic circuits.
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Chitkara and Synopsys have joined to conduct an ME program in Microelectronic Systems. A team named The TrailBlazers from the institute participated in the NASA second Annual Lunabotics Mining Competition held at Kennedy Space Center, Florida, USA.
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Schoelkopf serves as director of the Yale Center for Microelectronic Materials and Structures and as associate director of the Yale Institute for Nanoscience and Quantum Engineering. Since 2014, Schoelkopf is also the Director of the Yale Quantum Institute.
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Sitronics was founded in 1997 in Zelenograd and was initially named "Scientific Center". The company became a fully vertically integrated company by 2000 and was organized into three business streams: Telecom Solutions, Information Technologies, and Microelectronic Solutions. The first focused on the development and manufacture of software and hardware for fixed and mobile communications operators and corporations in the communications services sector while the second handled consulting, enterprise management systems, system integration, distribution, training, and after-sales services, among others. The third stream specialized in the design, manufacture and sale of microelectronic products such as computer chips and smart cards.
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The popularity of EM Microelectronic's range of ~125 kHz RFID devices has led to product from other manufacturers being advertised as "EM4100 compatible" although this may simply mean that the active device embedded in the RFID tag/card is an EM Microelectronic product.
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The seeker provides information on the deviation of the laser sport from the centre line of the detector. Sudarshan has an on-board flight-control computer with microelectronic-mechanical systems-based rate gyros. It also has high-precision linear ball-lead-screw actuators.
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Gilles Dambrine from the IEMN - Institute of Electronic, Microelectronic and Nanotechnology, Lille, France was named Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2016 for contributions to the modeling of small signal and noise characteristics in nanoscale high-frequency devices.
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Titanium silicide is used in the semiconductor industry. It is typically grown by means of salicide technology over silicon and polysilicon lines to reduce the sheet resistance of local transistors connections. In the microelectronic industry it is typically used in the C54 phase.
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Bismuth telluride is also used in many microelectronic devices, such as photoreceptors. Tellurium is sometimes used as an alternative to sulfur in vulcanized rubber. Cadmium telluride is used as a high-efficiency material in solar panels. Some of polonium's applications relate to the element's radioactivity.
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Most of these early synchronous CPUs ran at low clock rates compared to modern microelectronic designs. Clock signal frequencies ranging from 100 kHz to 4 MHz were very common at this time, limited largely by the speed of the switching devices they were built with.
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There is an emerging class of multicore/manycore processors taking the approach of a network on a chip (NoC), such as the Cell processor, Adapteva Epiphany architecture, Tilera, etc. The transputer and Inmos helped establish Bristol, UK, as a hub for microelectronic design and innovation.
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A factory manager, by 1990 Khizha was in charge of the "Svetlana" . PJSC Svetlana (Russian: ПАО «Светлана») is a company based in Saint Petersburg, Russian Federation.It is primarily involved in the research, design, and manufacturing of electronic and microelectronic instruments. Svetlana is part of Ruselectronics.
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Antireflective coatings are often used in microelectronic photolithography to help reduce image distortions associated with reflections off the surface of the substrate. Different types of antireflective coatings are applied either before or after the photoresist, and help reduce standing waves, thin-film interference, and specular reflections.
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Funding of Dolphin Integration Inc. in Montreal, Quebec, Canada for the development of power regulators. Reward at the tenth edition of Innovation Trophy, organized by the French National Industrial Property Institute. Trophy of the “best service partner” in microelectronic design for the twentieth anniversary of STMicroelectronics.
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600x600px Airborne command & control communication station, using modular "black box" construction, circa 1969. Circuits within modules are a planar design of multiple boards, which are themselves multilayer, mounting Collins microelectronic components. Collins computers shared these features. Both design and manufacture were done within a single Process Systems division.
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Under this new structural reform, Chongqing has set up development zones to help with attracting foreign investors and the growth of more advanced manufacturing industries, such as the electronics industry. Examples of these development zones include the Chongqing High Tech Industrial Development Zone, and the Xiyong Microelectronic Industrial Park.
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He won the Robbins Physics Prize in 1986, and was awarded his Ph.D. in September 1988. He was awarded an IBM post-doctoral fellowship for 1988–1989, and performed research on the design and fabrication of next- generation microelectronic devices at Harvard University.See, for example, Marco Iansiti et al.
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Germanium-tin is an alloy of the elements germanium and tin, both located in group 14 of the periodic table. It is only thermodynamically stable under a small composition range. Despite this limitation, it has useful properties for band gap and strain engineering of silicon integrated optoelectronic and microelectronic semiconductor devices.
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The Headgear Subsystem was the situational awareness hub of the system. It was intended to include integrated tactical processing by providing maps, routes, and data with a 180° emissive visor display, high bandwidth wireless communications, microelectronic/optics combat sensor suite that provides 360° situational awareness, and integrated small arms protection.
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He is known for his work on phase-change heat/mass transfer with droplets and bubbles, multi-phase flows, buoyancy- driven transport, and ionized arc-plasma transport with applications in condensation, combustion, microelectronic packaging, and micro-/macro- biological systems. He is the recipient of the 2014 Max Jakob Memorial Award.
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The ZCam by 3DV Systems is a range-gated system. Microsoft purchased 3DV in 2009. Microsoft's second-generation Kinect sensor was developed using knowledge gained from Canesta and 3DV Systems. Similar principles are used in the ToF camera line developed by the Fraunhofer Institute of Microelectronic Circuits and Systems and TriDiCam.
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V3021: Ultra Low Power 1-Bit 32 kHz real- time clock EM Microelectronic specialises in the design and production of ultra low power, low voltage integrated circuits for battery-operated and field-powered applications in consumer, automotive and industrial products. It has in-house semiconductor fabrication facilities and also uses external foundries.
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It includes the development of CMOS-based integrated chemical and biomicrosystems, as well as bioelectronics and high-density microelectrode arrays.U. Frey, U. Egert, F. Heer, S. Hafizovic, and A. Hierlemann (2009). Microelectronic System for High-Resolution Mapping of Extracellular Electric Fields Applied to Brain Slices. Biosensors and Bioelectronics, 24, pp. 2191-2198.
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The separation of microelectronic chips as prepared in semiconductor device fabrication from silicon wafers may be performed by the so-called stealth dicing process, which operates with a pulsed Nd:YAG laser, the wavelength of which (1064 nm) is well adapted to the electronic band gap of silicon (1.11 eV or 1117 nm).
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Svetlana Plant PJSC Svetlana () is a company based in Saint Petersburg, Russia. It is primarily involved in the research, design, and manufacturing of electronic and microelectronic instruments. Svetlana is part of Ruselectronics. The name of the company is said to originate from the words for 'light of an incandescent lamp' (СВЕТ ЛАмпочки НАкаливания).
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Adel Sedra, Kenneth Smith. Microelectronic Circuits, 5th ed. The example at right shows how a load line is used to determine the current and voltage in a simple diode circuit. The diode, a nonlinear device, is in series with a linear circuit consisting of a resistor, R and a voltage source, VDD.
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The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.
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He also led the creation of software systems for computer-aided design of optical systems. In 1970–1988, he headed the development of optical systems for production and quality control of microelectronic products. In 1976, he began teaching at LIPMO. Since 1982, he was a professor at the Department of the Optical instruments Theory.
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Since two conductors in equilibrium can have a built-in potential difference due to work function differences, this means that bringing dissimilar conductors into contact, or pulling them apart, will drive electric currents. These contact currents can damage sensitive microelectronic circuitry and occur even when the conductors would be grounded in the absence of motion.
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By adopting this method, the filter media caters for a wider range of particle sizes, resulting in greater control of retention and extending the life of the filter Li, Y. 2008, "Filter design consideration" in Microelectronic applications of chemical mechnailcal polarization, ed. Y. Li, 1st edn, John Wiley & Sons, New Jersey, pp. 588-589-560.
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Typical capacitance for consumer-sized (7–20 mm diameter) varistors are in the range of 100–2,500 pF. Smaller, lower-capacitance varistors are available with capacitance of ~1 pF for microelectronic protection, such as in cellular phones. These low-capacitance varistors are, however, unable to withstand large surge currents simply due to their compact PCB-mount size.
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In 2015, it employed 650 people in Armenia. In 2004, Synopsys Inc. acquired LEDA Systems, which had established an Interdepartmental Chair on Microelectronic Circuits and Systems with the State Engineering University of Armenia. The Chair, now part of the global Synopsys University Programme, supplies Armenia with more than 60 microchip and electronic design automation specialists each year.
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Micropattern gaseous detectors (MPGDs) are high granularity gaseous detectors with sub- millimeter distances between the anode and cathode electrodes. The main advantages of these microelectronic structures over traditional wire chambers include: count rate capability, time and position resolution, granularity, stability and radiation hardness . Examples of MPGDs are the microstrip gas chamber, the gas electron multiplier and the micromegas detector.
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Lanthanum tantalate (LaTaO4) contains isolated tetrahedra. As in the cases of other refractory metals, the hardest known compounds of tantalum are nitrides and carbides. Tantalum carbide, TaC, like the more commonly used tungsten carbide, is a hard ceramic that is used in cutting tools. Tantalum(III) nitride is used as a thin film insulator in some microelectronic fabrication processes.
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The circuit is named after George R. Wilson, an integrated circuit design engineer who worked for Tektronix.Sedra, A.S. & Smith, K.C.: "Microelectronic Circuits, 6th Ed.", OUP (2010), pp. 539 - 541. Wilson devised this configuration in 1967 when he and Barrie Gilbert challenged each other to find an improved current mirror overnight that would use only three transistors.
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Rudolph Technologies, Inc. is an American semiconductor company. Formed in 1940 and traded as on the New York Stock Exchange, it is a provider of process and process control equipment and software for microelectronic manufacturing industries (primarily semiconductor). The company's product offering includes automated defect inspection and metrology systems, probe card test and analysis systems, and lithography step-and-repeat systems.
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MIL-PRF-38535 is a United States military specification that establishes the general performance and verification requirements of single die integrated circuit device type electronics. It is a performance-based specification document defining the general requirements, as well as the quality assurance and reliability requirements, for the manufacture of microelectronic or integrated circuits used in military applications and high-reliability microcircuit application programs.
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Santosh Kurinec is an IEEE fellow and a professor of Electrical & Microelectronic Engineering at Kate Gleason College of Engineering in Rochester Institute of Technology (RIT). She is an Indian American electronic engineer specializing in electronic materials and devices. She is a former IEEE Electron Devices Society distinguished lecturer. In 2018, she was inducted into the Women in Technology International (WITI) Hall of Fame.
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Singh was born in Suva, Fiji to Dhirendra and Pritam Singh and completed his secondary and tertiary education in Brisbane, Australia. He attended The Kooralbyn International School and studied Microelectronic Engineering at Griffith University, majoring in Communications Systems, graduating with Honours in April 1995. He also holds qualifications in Automation and Control Systems as well as a range of industry accreditations.
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Fourth, there are manufacturers of information- processing devices that require research and sophisticated decision-making. These products are vital to information-processing activities of above mentioned industries. The products include computers of various levels and many other microelectronic devices, as well as software programs. Printing and copying machines, measurement and recording devices of various kinds, electronic or otherwise, are also in this category.
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In 1968, the RIT moved to a combined campus in Henrietta, New York. The College remains there today and is housed at the James E. Gleason Building and the Center for Microelectronic Engineering. In 1998, the College of Engineering was renamed the Kate Gleason College of Engineering, the only engineering college in the United States to be named after a woman.
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Instead of glass, a printed circuit on a stainless steel ruler is used to trigger at least two microelectronic hall effect sensors. Resolution is limited to 10 μm (0.0005 in) but shielding from coolant and flying chip is not a requirement. These scales are very resistant to everyday shop contaminants and debris. Electronic scales are much cheaper than their glass counterparts.
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Richard C. Jaeger, Travis N. Blalock, Microelectronic circuit design, pp. 46–47, McGraw-Hill Professional, 2003 . Solid-state electronics came into its own with the emergence of transistor technology. The first working transistor, a germanium-based point-contact transistor, was invented by John Bardeen and Walter Houser Brattain at Bell Labs in 1947, followed by the bipolar junction transistor in 1948.
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These mechanisms can be manufactured using the MEMS fabrication process, which allows them to be created on a very small scale. The ability to make piezoelectric generators on such a small scale is the main advantage of this method over the electromagnetic generators, especially when the generator is being developed to power microelectronic devices. Piezoelectric vibration generator has been commercialized.
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Adhesives, potting compounds and optical materials from DELO are mainly used for microelectronic and optical applications in consumer electronics and the automotive industry. The company specializes in UV curing and dual-curing polymers for high-volume industrial production. These products obtain their complete or initial strength under UV light. Delo is regarded the world market leader in smart card bonding, for example for encapsulating credit card chips.
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Nanocomputer refers to a computer smaller than the microcomputer, which is smaller than the minicomputer. Microelectronic components that are at the core of all modern electronic devices employ semiconductor transistors. The term nanocomputer is increasingly used to refer to general computing devices of size comparable to a credit card. Modern Single-Board Computers such as the Raspberry Pi and Gumstix would fall under this classification.
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Most cryptographic applications require numbers that are hundreds or even thousands of bits long. Such numbers are too large to be stored in a single machine word. Typically, the hardware performs multiplication mod some base B, so performing larger multiplications requires combining several small multiplications. The base B is typically 2 for microelectronic applications, 28 for 8-bit firmware, or 232 or 264 for software applications.
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"With a lot more time we could have had both quiet and reliable. We went for reliable, and did what we could with noise." Development of the treadmills was also utilized in order to further development of commercial products. Possible secondary effects of development include improved vibration and acoustic isolation applications in sensitive equipment such as equipment used in optical, microelectronic and precision manufacturing.
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By 1 April 2006 the "in Europe" was dropped from the project name, but the acronym was kept as EGEE-II for Enabling Grids for E-sciencE. This two-year phase cost about 52.6 million euro. The new name reflected a more global extent, such as a cluster of computers at the Institute of Microelectronic Systems in Malaysia. By 2007 the EGI was supported by 36 countries.
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Since 1988 Siegfried Selberherr is a chair professor for software technology of microelectronic systems at the TU Wien. He studied electrical engineering at the TU Wien, where he received the degree of Diplom-Ingenieur and the doctoral degree in technical sciences in 1978 and 1981, respectively, and the Habilitation in 1984. Afterwards he was a visiting researcher with the Bell-Labs for some time. Since 1996 Prof.
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To facilitate further preparation, the sawed specimen is usually embedded (or mounted or encapsulated) in a plastic disc, 25, 30 or 35 mm in diameter. A thermosetting solid resin, activated by heat and compression, e.g. mineral-filled epoxy, is best for most applications. A castable (liquid) resin such as unfilled epoxy, acrylic or polyester may be used for porous refractory ceramics or microelectronic devices.
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Several animal welfare organizations including the RSPCA and PETA have expressed concerns about the ethics and welfare of animals in this project. In the late 2010s, scientists have created cyborg jellyfish using a microelectronic prosthetic which propels the animal to swim almost three times faster while using just twice the metabolic energy of their unmodified peers. The prosthetics can be removed without harming the jellyfish.
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Microelectronic components are created by chemically fabricating wafers of semiconductors such as silicon (at higher frequencies, compound semiconductors like gallium arsenide and indium phosphide) to obtain the desired transport of electronic charge and control of current. The field of microelectronics involves a significant amount of chemistry and material science and requires the electronic engineer working in the field to have a very good working knowledge of the effects of quantum mechanics.
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Urmia University (; ) (also known as the University of Urmia) is a public university in West Azarbaijan province, Iran. The main campus of Urmia University is in Nazlu, in the vicinity of Urmia. It has six campuses, seven schools, more than 14,000 students, and several exclusive research centers including Microelectronic, Antenna and Microwave Laboratory, Nanotechnology, MEMS, and Artemia. Urmia University also has two satellite campuses in Khoy and Miyandoab city.
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National Research University of Electronic TechnologyEnglish official name for international usage.Contact information and Charter of MIET (, lit. National Research University "Moscow Institute of Electronic Technology"Direct translation of Russian official name.) – is a Russian technical university in the field of microelectronics, information and computer technologies and one of 29 National Research Universities. University is founded in 1965 and located in Zelenograd, Moscow (the Soviet Union's center of electronic and microelectronic engineering).
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As techniques have improved, the scale of microelectronic components has continued to decrease. At smaller scales, the relative impact of intrinsic circuit properties such as interconnections may become more significant. These are called parasitic effects, and the goal of the microelectronics design engineer is to find ways to compensate for or to minimize these effects, while delivering smaller, faster, and cheaper devices. Today, microelectronics design is largely aided by Electronic Design Automation software.
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Earlier he led NSF Expeditions on Variability in Microelectronic circuits. He was the inaugural co-director of the UC San Diego Halıcıoğlu Data Science Institute along with Cognitive Science professor Jeffrey Elman. In addition, he chaired the Computer Science and Engineering department at UC San Diego until 2016 during a time of extraordinary growth in Computer Science nationwide. He holds INRIA International Chair at the French international research institute in Rennes, Bretagne Atlantique.
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A penny scanned in an acoustic microscope at 50 MHz A scanning acoustic microscope (SAM) is a device which uses focused sound to investigate, measure, or image an object (a process called scanning acoustic tomography). It is commonly used in failure analysis and non-destructive evaluation. It also has applications in biological and medical research. The semiconductor industry has found the SAM useful in detecting voids, cracks, and delaminations within microelectronic packages.
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A FlowFET provides a way of controlling microfluidic flow in a way that uses no moving parts. This is in stark contrast to other solutions including pneumatically-actuated peristaltic pumps such as presented by Wu et al. Fewer moving parts allows less opportunity for mechanical breakdown of a microfluidic device. This may be increasingly relevant as large future iterations of large microelectronic fluidic (MEF) arrays continue to increase in size and complexity.
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In the remainder of the 1960s, Teledyne acquired some 90 more companies. A number of these businesses were in consumer products, such as Water Pik, Acoustic Research with high-fidelity speakers, and Olson Electronics that operated retail stores across America. Packard Bell Corporation had both consumer and government sales in computers and television receivers. A number of electronic product lines and smaller acquisitions were consolidated in Teledyne Electronics and Teledyne Microelectronic Technologies.
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In 1995, the company moved its headquarters from Simi Valley to Chatsworth. In 1999, Natel entered into an expanded agreement with Raytheon to make circuit types to build microelectronics for the F-15 and F/A-18 fighter jet radar, as well as Patriot, Sidewinder, Sparrow, Stinger and RAM missiles. In 2003, the company acquired the assets of Costa Mesa-based Scrantom Engineering Inc., which produced multilayer packages and substrates for microelectronic packaging.
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In the 1970s, he proposed to Indonesian government and industries at the time to do research and development of microelectronic devices domestically. His proposal and dream never got realized until his death. During his life, he was never tired to dream that someday there would be chip fabrication industries built in Indonesia. He was also active in the planning of Bandung High Tech Valley (BHTV) which tries to replicate the success of California's Silicon Valley in Indonesia.
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Microelectronic device fabrication methods can be employed to perform the 3D printing of nanoscale-size objects. Such printed objects are typically grown on a solid substrate, e.g. silicon wafer, to which they adhere after printing as they are too small and fragile to be manipulated post-construction. In one technique, 3D nanostructures can be printed by physically moving a dynamic stencil mask during the material deposition process, somewhat analogous to the extrusion method of traditional 3D printers.
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The next generation of C8500 computer used units similar to "black boxes" in avionics as part of a modular design. A Process Division was formed that combined the design and manufacture of planar circuit boards into one organization. Collins integrated circuits and other microelectronic components were mounted on Collins-built circuit boards. Modular construction allowed an easy expansion of computer capability in response to demand and provided benefits in manufacture and maintenance (boxes could be swapped).
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An organic light-emitting transistor (OLET) is a form of transistor that emits light. These transistors have potential for digital displays and on-chip optical interconnects. OLET is a new light-emission concept, providing planar light sources that can be easily integrated in substrates like silicon, glass, and paper using standard microelectronic techniques. OLETs differ from OLEDs in that an active matrix can be made entirely of OLETs, whereas OLEDs must be combined with switching elements such as TFTs.
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In recent years, interest has turned to using rectennas as power sources for small wireless microelectronic devices. The largest current use of rectennas is in RFID tags, proximity cards and contactless smart cards, which contain an integrated circuit (IC) which is powered by a small rectenna element. When the device is brought near an electronic reader unit, radio waves from the reader are received by the rectenna, powering up the IC, which transmits its data back to the reader.
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At the smallest scales, mechanical engineering becomes nanotechnology—one speculative goal of which is to create a molecular assembler to build molecules and materials via mechanosynthesis. For now that goal remains within exploratory engineering. Areas of current mechanical engineering research in nanotechnology include nanofilters,Nilsen, Kyle. (2011) "Development of Low Pressure Filter Testing Vessel and Analysis of Electrospun Nanofiber Membranes for Water Treatment" nanofilms,Mechanical Characterization of Aluminium Nanofilms, Microelectronic Engineering, Volume 88, Issue 5, May 2011, pp. 844–847.
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Filter ceiling grid of a cleanroom for microelectronic (semiconductor) manufacturing with filter fan units installed A fan filter unit (FFU) is a type of motorized air filtering equipment. It is used to supply purified air to cleanrooms, laboratories, medical facilities or microenvironments by removing harmful airborne particles from recirculating air. The units are installed within the system's ceiling or floor grid. Large cleanrooms require a proportionally large number of FFUs, which in some cases may range from several hundred to several thousand.
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From these adhesive interactions the friction image of patterned sample surface can be found. Probe tips used in force microscopy can provide imaging of structure and dynamics of adsorbate at the nanometer scale. Self-assembled functionalized organic thiols on the surface of Au coated Si3N4 probe tips have been used to study the interaction between molecular groups. Again, carbon nanotube probe tips in conjunction with AFM can be used for probing crevices that occur in microelectronic circuits with improved lateral resolution.
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The city seal has the brands of Rancho Mission Viejo and Rancho Santa Margarita and Las Flores on the border, with artwork containing Santiago Peak in the background. The tower in the foreground symbolizes the Rancho Santa Margarita Lake Tower. Hughes Aircraft Company's Microelectronic Systems Division moved to Rancho Santa Margarita in May 1988 from Irvine. In August 1992, the Hughes plant closed its facilities and moved the division to Carlsbad, California due to budget constraints in the aerospace industry.
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MIMOS Berhad (or MIMOS) is Malaysia's national applied research and development centre under the Ministry of Science, Technology And Innovation (MOSTI). The company was founded as the Malaysian Institute of Microelectronic Systems in 1985, currently a public company wholly owned by Minister of Finance Incorporated (MoF Inc.). MIMOS owns five national-level facilities to support the industry and government agencies in undertaking Big Data Analytics, Internet of Things, Nano Fabrication or Smart Manufacturing, Industrial Design & User Experience and Hardware Prototyping & Reliability respectively.
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In 2004, Natel acquired assets from National Semiconductor's, as well as assets and intellectual property from CMC Wireless. In 2005, Natel entered into a merger purchase agreement with Hytek Microsystems, a manufacturer of microelectronic assemblies, with Hytek becoming a subsidiary of Natel. In 2005, Natel also acquired Thin Film Concepts in Elmsford, NY, expanding capabilities in CVD thin film technologies. In 2013, the company acquired EPIC Technologies of Ohio from the Chicago-based private equity firm CIVC Partners for an undisclosed amount.
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Computervision was crucial to Sun Microsystems development as a company. CV was Sun's first large customer for Unix-based workstations. The CDS3000 series of workstations were actually Sun-2 systems with additional graphics hardware from CV. Ultimately in 1987, CV migrated from the CGP systems to Sun-3-based workstations known as CADDStations with a VME bus version of the GPU. Computervision merged with Prime Computer in 1988 and acquired GE Calma (its major competitor in the microelectronic CAD market) in 1989.
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In electronic systems, printed circuit boards are made from epoxy plastic and fibreglass. The nonconductive boards support layers of copper foil conductors. In electronic devices, the tiny and delicate active components are embedded within nonconductive epoxy or phenolic plastics, or within baked glass or ceramic coatings. In microelectronic components such as transistors and ICs, the silicon material is normally a conductor because of doping, but it can easily be selectively transformed into a good insulator by the application of heat and oxygen.
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Research under his direction has included silicon microphotonics, and the development of the earliest 1MB DRAM as well as long-lasting telecommunications lasers. His group has also developed semiconductor diagnostic methods including deep-level transient spectroscopy, SEM-electron beam-induced current and RF-PCD. Silicon processing is a focus of his research, encompassing integrated circuit fabrication, microphotonic materials and devices, solar energy conversion and environmentally benign integrated circuit manufacturing. The aim of his group's microphotonics research is to integrate optical interconnection with integrated microelectronic circuit chips.
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At a Sn content beyond approximately 9%, germanium-tin alloys become direct gap semiconductors having efficient light emission suitable for the fabrication of lasers. Since the constituent elements are chemically compatible with silicon, it is possible to integrate such lasers directly onto silicon microelectronic devices, enabling on-chip optical communication. This is still an active research area, but germanium-tin lasers operating at low temperatures have already been demonstrated. In addition, germanium-tin light emitting diodes operating at room temperature have also been reported.
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The Moscow Jewelry FactorySee also: The Official Site of the Moscow Jewelry Factory. Retrieved on July 7, 2006. and the JewellerpromSee also: The Official Site of the Experimental Moscow Jewelry Atelier Jewellerprom. Retrieved on July 7, 2006, are producers of jewellery in Russia; Jewellerprom used to produce the exclusive Order of Victory, awarded to those aiding the Soviet Union's Red Army during World War II. There are other industries located just outside the city of Moscow, as well as microelectronic industries in Zelenograd, including Ruselectronics companies.
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In 1983, VHDL was originally developed at the behest of the U.S. Department of Defense in order to document the behavior of the ASICs that supplier companies were including in equipment. The standard MIL-STD-454N in Requirement 64 in section 4.5.1 "ASIC documentation in VHDL" explicitly requires documentation of "Microelectronic Devices" in VHDL. The idea of being able to simulate the ASICs from the information in this documentation was so obviously attractive that logic simulators were developed that could read the VHDL files.
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Micropattern gaseous detectors (MPGDs) are a group of gaseous ionization detectors consisting of microelectronic structures with sub-millimeter distances between anode and cathode electrodes. When interacting with the gaseous medium of the detector, particles of ionizing radiation create electrons and ions that are subsequently drifted apart by means of an electric field. The accelerated electrons create further electron-ion pairs in an avalanche process in regions with a strong electrostatic field. The various types of MPGDs differ in the way this strong field region is created.
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In particular, they called for the use of wireless, noninvasive methods of neuronal activity detection, either utilizing microelectronic very-large-scale integration, or based on synthetic biology rather than microelectronics. In one such proposed method, enzymatically produced DNA would serve as a "ticker tape record" of neuronal activity, based on calcium ion-induced errors in coding by DNA polymerase. Data would be analyzed and modeled by large scale computation. A related technique proposed the use of high-throughput DNA sequencing for rapidly mapping neural connectivity.
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Rhonda Franklin (born 1965) is a Professor of Electrical and Computer Engineering at the University of Minnesota. She is a microwave and radio frequency engineer whose research focuses on microelectronic mechanical structures in radio and microwave applications. She has won several awards, including the 1998 NSF Presidential Early Career Award for Scientists and Engineers, the 2013 Sara Evans Leadership Award, the 2017 John Tate Award for Excellence in Undergraduate Advising, and the 2018 Minnesota African American Heritage Calendar Award for her contributions to higher education.
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The most widespread industrial application of KrF excimer lasers has been in deep- ultraviolet photolithography for the manufacturing of microelectronic devices (i.e., semiconductor integrated circuits or “chips”). From the early 1960s through the mid-1980s, Hg-Xe lamps had been used for lithography at 436, 405 and 365 nm wavelengths. However, with the semiconductor industry's need for both finer resolution (for denser and faster chips) and higher production throughput (for lower costs), the lamp-based lithography tools were no longer able to meet the industry's requirements.
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AsH3 is used in the synthesis of semiconducting materials related to microelectronics and solid-state lasers. Related to phosphorus, arsenic is an n-dopant for silicon and germanium. More importantly, AsH3 is used to make the semiconductor GaAs by chemical vapor deposition (CVD) at 700–900 °C: ::Ga(CH3)3 \+ AsH3 → GaAs + 3 CH4 For microelectronic applications, arsine can be provided via a sub-atmospheric gas source. In this type of gas package, the arsine is adsorbed on a solid microporous adsorbent inside a gas cylinder.
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Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices. Smaller wafers were used in the early days of the microelectronics industry, with wafers being just 1 inch in diameter in the 1950s.
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Microprocessor Microelectronics engineering deals with the design and microfabrication of very small electronic circuit components for use in an integrated circuit or sometimes for use on their own as a general electronic component. The most common microelectronic components are semiconductor transistors, although all main electronic components (resistors, capacitors etc.) can be created at a microscopic level. Nanoelectronics is the further scaling of devices down to nanometer levels. Modern devices are already in the nanometer regime, with below 100 nm processing having been standard since around 2002.
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SVM is particularly well suited to analyzing microelectronic devices (such as transistors or diodes) or quantum electronic devices (such as quantum well diode lasers) directly because nanometer spatial resolution is possible. SVM can also be used to verify theoretical simulation of complex electronic devices. For example, the potential profile across the quantum well structure of a diode laser can be mapped and analyzed; such a profile could indicate the electron and hole distributions where light is generated and could lead to improved laser designs.
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Proposal submitted to DARPA in 1986 first introducing the term "microelectromechanical systems" MEMS microcantilever resonating inside a scanning electron microscope Microelectromechanical systems (MEMS), also written as micro-electro-mechanical systems (or microelectronic and microelectromechanical systems) and the related micromechatronics and microsystems constitute the technology of microscopic devices, particularly those with moving parts. They merge at the nanoscale into nanoelectromechanical systems (NEMS) and nanotechnology. MEMS are also referred to as micromachines in Japan and microsystem technology (MST) in Europe. MEMS are made up of components between 1 and 100 micrometers in size (i.e.
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In semiconductor manufacturing, a low-κ is a material with a small relative dielectric constant (κ, kappa) relative to silicon dioxide. Low-κ dielectric material implementation is one of several strategies used to allow continued scaling of microelectronic devices, colloquially referred to as extending Moore's law. In digital circuits, insulating dielectrics separate the conducting parts (wire interconnects and transistors) from one another. As components have scaled and transistors have gotten closer together, the insulating dielectrics have thinned to the point where charge build up and crosstalk adversely affect the performance of the device.
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This water electrolysis can alter the pH in the channel and adversely affect biological cells and biomolecules, while gas bubbles tend to "clog" microfluidic systems. In further analogy with microelectronic systems, the switching time for a flowFET is inversely proportional to its size. Scaling down a flowFET results in a reduction in the amount of time for the flow to equilibrate to a new flow rate following a change in the applied electrical field. It should be noted, however, that the frequency of flowFET is many orders of magnitude slower than with an electronic FET.
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The term high-κ dielectric refers to a material with a high dielectric constant (κ, kappa), as compared to silicon dioxide. High-κ dielectrics are used in semiconductor manufacturing processes where they are usually used to replace a silicon dioxide gate dielectric or another dielectric layer of a device. The implementation of high-κ gate dielectrics is one of several strategies developed to allow further miniaturization of microelectronic components, colloquially referred to as extending Moore's Law. Sometimes, these materials are called "high-k" (spoken high kay), instead of "high-κ" (high kappa).
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Kurinec received several awards for her contributions to the field of microelectronics and engineering education. Most notably, she was inducted into the Women in Technology International (WITI) Hall of Fame in 2018 and she was elected as a Fellow of IEEE in 2011, for leadership in integrating innovative microelectronics research in engineering education. She received the Medal of Honor from the International Association of Advanced Materials in 2016. She received the IEEE Undergraduate Teaching Award in 2012, for distinguished contributions integrated research into undergraduate engineering education to develop microelectronic engineers well prepared for future challenges.
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W. Lehnert, B. A. Turek, K. Bladh, L. F. Spietz, D. Gunnarsson, P. Delsing and R. J. Schoelkopf, "Measurement of the excited-state lifetime of a microelectronic circuit", Phys. Rev. Lett. 90, 027002 (2003), In superconducting quantum computing, a charge qubit is formed by a tiny superconducting island (also known as a Cooper-pair box) coupled by a Josephson junction (or practically, superconducting tunnel junction) to a superconducting reservoir (see figure). The state of the qubit is determined by the number of Cooper pairs which have tunneled across the junction.
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Chen Yung-Jui received his BS in Physics from National Tsing Hua University in 1969 and Ph.D. in Physics at the University of Pennsylvania (1976). After a brief postdoctoral period at Penn, he joined the Advanced Microelectronic Laboratory at McDonnell Douglas Astronautics Co. in 1977. From 1980 to 1987, Dr. Chen conducted fiber optical communications related research at GTE Laboratories. During the ten years in industry, he worked on MOS/MNOS VLSI technology, wafer scale integration, Ultra-fast optical spectroscopy, nonlinear optics of semiconductors and organic polymers, integrated optics and optoelectronic devices.
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Organogermanes of the type R4Ge with alkyl (R) groups are accessed through the cheapest available germanium precursor germanium tetrachloride and alkyl nucleophiles. The following trends are observed going down the carbon group: The nucleophilicity increases Si2CHCH2)GeH3 is the organogermanium hydride that is a high vapor pressure liquid germanium source for MOVPE. Isobutylgermane is currently investigated as safer and less hazardous alternative to toxic germane gas in microelectronic applications. Tris(trimethylsilyl)germanium hydride (Me3Si)3GeH has been investigated as a non-toxic alternative to many tin hydrides such as tributyltinhydride.
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The problem of obsolescence is most prevalent for electronics technology, wherein the procurement lifetimes for microelectronic parts are often significantly shorter than the manufacturing and support life cycles for the products that use the parts. However, obsolescence extends beyond electronic components to other items, such as materials, textiles, and mechanical parts. In addition, obsolescence has been shown to appear for software, specifications, standards, processes, and soft resources, such as human skills. It is highly important to implement and operate an active management of obsolescence to mitigate and avoid extreme costs.
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During the period from 1960–1980 Mikron actively developed microelectronic technologies for the USSR. In 2010, Mikron obtained a license for a 90 nm process, with production starting around 2012–2013. The 90 nm production facilities and the design center were co- financed almost up to 50% by Rusnano, with a total cost of 16,57 billion Russian rubles. In 2014, due to the suspension of activities between Visa, MasterCard and certain Russian banks, Mikron hoped to receive orders related to the creation of the Russian national card payment system to be launched in 2015.
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In October 1959, Minister of the Interior Alexandru Drăghici appointed him as head of Romania's brand new industrial espionage department, called S&T; (short for Ştiinţă şi Tehnologie, meaning "science and technology" in Romanian) of Directorate I, being the head of Romanian industrial espionage, which he managed until his defection in 1978. He was involved with the establishment of Romania's automobile industry, and with the development of its microelectronic, polymer, and antibiotic industries. Between 1972 and 1978, Pacepa was also President Nicolae Ceauşescu's adviser for industrial and technological development and the deputy chief of the Romanian foreign intelligence service.
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Silicon wafer for use in electronic devices Because of its direct relevance to products of commerce, solid state inorganic chemistry has been strongly driven by technology. Progress in the field has often been fueled by the demands of industry, sometimes in collaboration with academia. Applications discovered in the 20th century include zeolite and platinum-based catalysts for petroleum processing in the 1950s, high-purity silicon as a core component of microelectronic devices in the 1960s, and “high temperature” superconductivity in the 1980s. The invention of X-ray crystallography in the early 1900s by William Lawrence Bragg was an enabling innovation.
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Overdrive voltage, usually abbreviated as VOV, is typically referred to in the context of MOSFET transistors. The overdrive voltage is defined as the voltage between transistor gate and source (VGS) in excess of the threshold voltage (VTH) where VTH is defined as the minimum voltage required between gate and source to turn the transistor on (allow it to conduct electricity). Due to this definition, overdrive voltage is also known as "excess gate voltage" or "effective voltage."Sedra and Smith, Microelectronic Circuits, Fifth Edition, (2004) Chapter 4, Overdrive voltage can be found using the simple equation: VOV = VGS − VTH.
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For quartz wristwatches, subsidiaries of Swatch manufacture watch batteries (Renata), oscillators (Oscilloquartz, now Micro Crystal AG) and integrated circuits (Ebauches Electronic SA, renamed EM Microelectronic-Marin). The launch of the new SWATCH brand in 1983 was marked by bold new styling, design, and marketing. Today, the Swatch Group maintains its position as the world's largest watch company. Seiko's efforts to combine the quartz and mechanical movements bore fruit after 20 years of research, leading to the introduction of the Seiko Spring Drive, first in a limited domestic market production in 1999 and to the world in September 2005.
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Microelectromechanical systems chip, sometimes called "lab on a chip" After the invention of microtechnology (~1954) for realizing integrated semiconductor structures for microelectronic chips, these lithography-based technologies were soon applied in pressure sensor manufacturing (1966) as well. Due to further development of these usually CMOS-compatibility limited processes, a tool box became available to create micrometre or sub-micrometre sized mechanical structures in silicon wafers as well: the Micro Electro Mechanical Systems (MEMS) era had started. Next to pressure sensors, airbag sensors and other mechanically movable structures, fluid handling devices were developed. Examples are: channels (capillary connections), mixers, valves, pumps and dosing devices.
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Kurinec worked as a postdoctoral research associate at the Department of Materials Science and Engineering at University of Florida from 1985 to 1986. She worked as an assistant professor of Electrical Engineering at the Florida A&M; University – Florida State University College of Engineering from 1986 to 1988, before joining RIT as an Associate Professor in 1988. She succeeded Lynn Fuller as the second Head of the Department of Microelectronic Engineering in RIT from 2001 to 2009. Kurinec has served as a visiting scholar and researcher at the IBM Watson Research Center in New York since 2008.
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A major field of application became their use in integrated passive devices and integrated circuits, where the electrical network among active and passive devices like transistors and capacitors etc. is built up from thin Al or Cu layers. These layers dispose of thicknesses in the range of a few 100 nm up to a few µm, and they are often embedded into a few nm thin titanium nitride layers in order to block a chemical reaction with the surrounding dielectric like SiO2. The figure shows a micrograph of a laterally structured TiN/Al/TiN metal stack in a microelectronic chip.
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Nathanson conceived the first MEMS device in 1965 to serve as a tuner for microelectronic radios. It was developed with Robert A. Wickstrom and William E. Newell at Westinghouse Research Labs in Pittsburgh, PA., and patented as a Microelectric Frequency Selective Apparatus. A refined version of the device was subsequently patented as the Resonant Gate Transistor. In his work developing similar devices, Nathanson pioneered a method of batch fabrication in which layers of insulators and metal on silicon wafers are shaped and undercut through the use of masks and sacrificial layers, a process that would later become a mainstay of MEMS manufacturing.
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In its deuterated form (DMSO-d6), it is a useful solvent for NMR spectroscopy, again due to its ability to dissolve a wide range of analytes, the simplicity of its own spectrum, and its suitability for high-temperature NMR spectroscopic studies. Disadvantages to the use of DMSO-d6 are its high viscosity, which broadens signals, and its hygroscopicity, which leads to an overwhelming H2O resonance in the 1H-NMR spectrum. It is often mixed with CDCl3 or CD2Cl2 for lower viscosity and melting points. DMSO is finding increased use in manufacturing processes to produce microelectronic devices.
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Microelectronic devices using open drain signals (such as microcontrollers) may provide a weak (high-resistance) internal pull- up resistor to connect the terminal in question to the positive power supply of the device. Such weak pullups, often on the order of 100 kΩ, reduce power usage by keeping input signals from floating and may avoid the need for an external pull-up component. External pullups are stronger (lower resistance, perhaps 3 kΩ) to reduce signal rise times (like with I²C) or to minimize noise (like on system inputs). Internal pullups can usually be disabled if they are not wanted.
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Shur has led many research efforts in diverse fields related to semiconductor devices, solid-state physics, and engineering, such as plasma wave electronics, thin film transistors, laser technology, sub micrometre field effect transistors, terahertz technology, Surface Acoustic and Acousto-Optic devices. Having written over 1,000 technical publications, the Institute for Scientific Information, an organization which tracks citations, lists him as one of the most quoted researchers in his field. He has also authored, co-authored, or served as editor for 32 books. As of 2004, he holds 27 patents for a wide variety of microelectronic innovations.
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The driving force in designing new polymers is the prospect of replacing other materials of construction, especially metals, by using lightweight and heat- resistant polymers. The advantages of lightweight polymers include: high strength, solvent and chemical resistance, contributing to a variety of potential uses, such as electrical and engine parts on automotive and aircraft components, coatings on cookware, coating and circuit boards for electronic and microelectronic devices, etc. Polymer chains based on aromatic rings are desirable due to high bond strengths and rigid polymer chains. High molecular weight and crosslinking are desirable for the same reason.
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891–893, 1979 rather than use the prefix micro that had been common parlance until then. These membrane samples also found application many years later in MEMs (Micro-Electro-Mechanical) devices, and also as 'cantilevers' in biomedical applications. Early experiments with X-ray lithography also used similar membranes. When he arrived back in Cambridge, Lord Broers set up a nanofabrication laboratory to extend the technology of miniaturisation to the atomic scale by developing some of the novel fabrication methods"Electron Beam Lithography—Resolution Limits", Broers, A. N.; Hoole A. C. N. and Ryan J. M.; Microelectronic Engineering 32, pp.
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Microelectronic Engineering 6, 31-51 TSMC began commercial production of 90 nanometer semiconductor nodes using immersion lithography in 2004. The same year, IBM's director of silicon technology, Ghavam Shahidi, announced that IBM plans to commercialize lithography based on light filtered through water. Immersion lithography is now being extended to sub-20nm nodes through the use of multiple patterning. The ability to resolve features in optical lithography is directly related to the numerical aperture of the imaging equipment, the numerical aperture being the sine of the maximum refraction angle multiplied by the refractive index of the medium through which the light travels.
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Chemical CO2 gas sensors with sensitive layers based on polymer- or heteropolysiloxane have the principal advantage of very low energy consumption, and that they can be reduced in size to fit into microelectronic- based systems. On the downside, short and long term drift effects, as well as a rather low overall lifetime, are major obstacles when compared with the NDIR measurement principle.Reliable CO2 Sensors Based with Silicon-based Polymers on Quartz Microbalance Transducers, R. Zhou, S. Vaihinger, K.E. Geckeler, and W. Göpel, Conf.Proc.Eurosensors VII, Budapest (H) (1993); Sensors and Actuators B, 18–19, 1994, 415–420.
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The university has two National Science Foundation–funded Engineering Research Centers: the Integrated Media Systems Center and the Center for Biomimetic Microelectronic Systems. The Department of Homeland Security selected USC as its first Homeland Security Center of Excellence. Since 1991, USC has been the headquarters of the NSF and USGS funded Southern California Earthquake Center (SCEC). The University of Southern California is a founding and charter member of CENIC, the Corporation for Education Network Initiatives in California, the nonprofit organization, which provides extremely high-performance Internet-based networking to California's K-20 research and education community.
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The capsule approach originally described by White et al., using microencapsulated dicyclopentadiene (DCPD) monomer and Grubbs' catalyst to self-heal epoxy polymer was later adapted to epoxy adhesive films that are commonly used in the aerospace and automotive industries for bonding metallic and composite substrates. Recently, microencapsulated liquid suspensions of metal or carbon black were used to restore electrical conductivity in a multilayer microelectronic device and battery electrodes respectively; however the use of microencapsulation for restoration of electrical properties in coatings is limited. Liquid metal microdroplets have also been suspended within silicone elastomer to create stretchable electrical conductors that maintain electrical conductivity when damaged, mimicking the resilience of soft biological tissue.
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Thin films are often deposited to protect an underlying work piece from external influences. The protection may operate by minimizing the contact with the exterior medium in order to reduce the diffusion from the medium to the work piece or vice versa. For instance, plastic lemonade bottles are frequently coated by anti-diffusion layers to avoid the out-diffusion of CO2, into which carbonic acid decomposes that was introduced into the beverage under high pressure. Another example is represented by thin TiN films in microelectronic chips separating electrically conducting aluminum lines from the embedding insulator SiO2 in order to suppress the formation of Al2O3.
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These advantages include improvement of reliability by reducing unwanted surface inversion at the gate edges that occurs in the standard MOSFET. Since the gate edges are enclosed in ELT, there is no gate oxide edge (STI at gate interface), and thus the transistor off-state leakage is reduced considerably. Low-power microelectronic circuits including computers, communication devices and monitoring systems in the space shuttle and satellites are very different to what is used on earth. They require radiation (high-speed atomic particles like proton and neutron, solar flare magnetic energy dissipation in Earth's space, energetic cosmic rays like X-ray, gamma ray etc.) tolerant circuits.
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An optical switch may operate by mechanical means, such as physically shifting an optical fiber to drive one or more alternative fibers, or by electro-optic effects, magneto-optic effects, or other methods. Slow optical switches, such as those using moving fibers, may be used for alternate routing of an optical switch transmission path, such as routing around a fault. Fast optical switches, such as those using electro- optic or magneto-optic effects, may be used to perform logic operations; also included in this category are semiconductor optical amplifiers, which are optoelectronic devices that can be used as optical switches and be integrated with discrete or integrated microelectronic circuits.
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The university currently offers eight PhD programs: Imaging science, Microsystems Engineering, Computing and Information Sciences, Color science, Astrophysical Sciences and Technology, Sustainability, Engineering, and Mathematical modeling. In 1986, RIT founded the Chester F. Carlson Center for Imaging Science, and started its first doctoral program in Imaging Science in 1989. The Imaging Science department also offers the only Bachelors (BS) and Masters (MS) degree programs in imaging science in the country. The Carlson Center features a diverse research portfolio; its major research areas include Digital Image Restoration, Remote Sensing, Magnetic Resonance Imaging, Printing Systems Research, Color Science, Nanoimaging, Imaging Detectors, Astronomical Imaging, Visual Perception, and Ultrasonic Imaging. The Center for Microelectronic and Computer Engineering was founded by RIT in 1986.
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Most of these experiments utilized a microelectronic REG, but experiments were also conducted with "a giant, wall-mounted pachinko-like machine with a cascade of bouncing balls". In 1986 associates of PEAR published data collected over the course of seven years from a group of subjects attempting to influence random number generators across millions of trials. In all cases, the observed effects were very small (between one and about 0.1%), and although the statistical significance of the results at the P<0.05 level is not generally disputed, detractors point to potential ethical violations and flaws in experiment procedures, as well as questioning the importance of large-sample studies that only marginally clear the p<0.05 significance threshold.
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A logic gate is an idealized or physical electronic device implementing a Boolean function, a logical operation performed on one or more binary inputs that produces a single binary output. Depending on the context, the term may refer to an ideal logic gate, one that has for instance zero rise time and unlimited fan-out, or it may refer to a non-ideal physical deviceJaeger, Microelectronic Circuit Design, McGraw-Hill 1997, , pp. 226–233 (see Ideal and real op-amps for comparison). Logic gates are primarily implemented using diodes or transistors acting as electronic switches, but can also be constructed using vacuum tubes, electromagnetic relays (relay logic), fluidic logic, pneumatic logic, optics, molecules, or even mechanical elements.
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Aircraft passengers and the crew are more prone to dangerous exposure from radiation during an ionospheric storm. Flight altitudes are usually 10 km or more, so when an ionospheric storm occurs during the flight, people on the plane will potentially gain an approximate 0.1% chance of developing a lethal cancer during their lifetime. The plane when flying at a 10 km or above altitude will have around 300 times more exposure to ionised radiation than on sea level. The energised particles produced by the ionospheric storm will also potentially cause damage and disrupt "microelectronic circuitry" due to single event effect (SEE), when the energised particles interconnect with the semiconductor device and causes system failure.
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IEEE Design & Test of Computers, or IEEE Design & Test, or simply Design & Test, is a magazine is cosponsored by the Council on EDA, Circuits and Systems Society, and the IEEE Solid State Circuits Society of the IEEE. It is a magazine, rather than a scholarly journal, and hence has articles of general interest to those working in the field, not just research articles. The web site of the magazine states the charter as offering "original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software." The current editor is Joerg Henkel of Karlsruhe Institute of Technology.
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Taken to TPC headquarters in New Jersey, he is introduced to its leader, who wants Schaefer's help in carrying out their plan for world domination. As the TPC leader makes his presentation, a camera closeup reveals electronic cables connected to one of his feet, revealing that he is actually an animatronic robot. TPC has developed a "modern electronic miracle", the Cerebrum Communicator (CC), a microelectronic device that can communicate wirelessly with any other CC in the world. With the CC implanted in the brain, a user need only think of the phone number to be called, and is instantly connected, thus eliminating the need for The Phone Company's massive and expensive wired infrastructure.
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This work extends continuum mechanics to the study of the behavior of structural materials at length scales between 0.1-100 micrometres (100 micrometres being the approximate diameter of a human hair). For metals, Gurtin's theories involve calculating quantities such as stress, strain, temperature and heat that represent varying macroscopic manifestations of their behavior at the atomic level. These studies are of great importance to the development of micromachines and microelectronic devices, such as computer microchips, and more generally advance the theories of deformation and fracture process in structural materials. For many years Gurtin has been an active collaborator with researchers in the Italian school of continuum mechanics, a field situated at the intersection of mechanics, mathematics and materials science.
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These were the first man-made nanostructures in materials suitable for microelectronic circuits opening up the possibility for the extreme miniaturization of electronic circuits that was to occur in the decades to come. After graduating from Cambridge, Lord Broers spent nearly 20 years in research and development with IBM in the United States. He worked for sixteen years at the Thomas J Watson Research Centre in New York, then for 3 years at the East Fishkill Development Laboratory, and finally at Corporate Headquarters. His first assignment at the T J Watson Research laboratory was to find a long life electron emitter to replace the tungsten wire filaments used in electron microscopes at the time.
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Around 1970, scientists learned that by arraying large numbers of microscopic transistors on a single chip, microelectronic circuits could be built that dramatically improved performance, functionality, and reliability, all while reducing cost and increasing volume. This development led to the Information Revolution. More recently, scientists have learned that not only electrical devices, but also mechanical devices, may be miniaturized and batch- fabricated, promising the same benefits to the mechanical world as integrated circuit technology has given to the electrical world. While electronics now provide the ‘brains’ for today's advanced systems and products, micro- mechanical devices can provide the sensors and actuators — the eyes and ears, hands and feet — which interface to the outside world.
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Bacteria analysis is typically conducted following ASTM method F1094.ASTM F1094 Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method The test method covers sampling and analysis of high purity water from water purification systems and water transmission systems by the direct sampling tap and filtration of the sample collected in the bag. These test methods cover both the sampling of water lines and the subsequent microbiological analysis of the sample by the culture technique. The microorganisms recovered from the water samples and counted on the filters include both aerobes and facultative anaerobes.
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As the result of substrate effects producing preferred crystallite orientations, pronounced textures tend to occur in thin films Highly oriented TiO2 films on quartz substrates Surface coatings and technology . Modern technological devices to a large extent rely on polycrystalline thin films with thicknesses in the nanometer and micrometer ranges. This holds, for instance, for all microelectronic and most optoelectronic systems or sensoric and superconducting layers. Most thin film textures may be categorized as one of two different types: (1) for so-called fiber textures the orientation of a certain lattice plane is preferentially parallel to the substrate plane; (2) in biaxial textures the in-plane orientation of crystallites also tend to align with respect to the sample.
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In July 2012, IBM and five leading Russian innovation companies: the Skolkovo Foundation, Rusnano, Rostelecom, Russian Venture Company and ITFY, all signed a collaboration agreement to foster a culture of applied research and commercialization and attract key talent and investment from around the world in the area of microelectronics. The agreement will give the Electronics Technology Center access to IBM's intellectual property for chip design. IBM will also provide cloud computing technologies to form the basis of a new virtual design environment to be used to develop new microelectronic devices such as sensors to be used in smarter infrastructure projects, industry and consumer electronics. The cloud will help unite Russia's dispersed microelectronics development teams and provide access to advanced technologies and best practice and foster global collaboration.
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Daniels-Race joined the Department of Electrical and Computer Engineering faculty at Duke University in 1989, where she established the university's first molecular beam epitaxy laboratory and founded their experimental research programme into III-IV semiconductor materials, with federal funding from the National Science Foundation. She was a visiting scholar at the Microelectronics Research Center at the University Texas Austin in spring 1995. From 2001-2003, she was awarded funding from the US Department of Energy to investigate the effects of variation in molecular beam epitaxy growth of tensile-strained two-dimensional structures. Her work at Duke was also focused on studying quantum mechanical phenomena such as electron-phonon interactions, and developing microelectronic devices based on GaAs, AlGaAs and InAlAs quantum wells.
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From 1977 to 1990 he headed the Institute of Cybernetics and Information Processes of the German Academy of Sciences at Berlin with more than 600 employees. Moving to the microelectronic industry, he led the Engineering Department of ams AG and later the Strategic Product Development from 1990 to 2003, and in 2003 co- founded SensorDynamics AG an Austrian semiconductor company that focused on innovative sensor solutions for high volume applications in automotive and industry, of which he has been the VP of R&D.; He has authored over 100 papers and more than 20 patents, four books and five scientific anthologies, and edited four journals and book series. He has been in the program committee of several major international conferences, like ESSCIRC and DTIP.
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Two proposed approaches to overcome the to date limitations are either to make very tiny local connections that will be needed in future advanced chips or to make carbon metal composite structure that will be compatible with existing microelectronic processes. Hybrid interconnects that employ CNT vias in tandem with copper interconnects may offer advantages in reliability and thermal- management. In 2016, the European Union has funded a four million euro project over three years to evaluate manufacturability and performance of composite interconnects employing both CNT and copper interconnects. The project named CONNECT (CarbON Nanotube compositE InterconneCTs) involves the joint efforts of seven European research and industry partners on fabrication techniques and processes to enable reliable Carbon NanoTubes for on-chip interconnects in ULSI microchip production.
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The most widespread application of excimer laser has been in photolithography, a critical technology used in the manufacturing of microelectronic devices like cell phones. His contributions to the development of new and high power lasers merited his election by his peers to be a fellow of both the American Physical Society and the Institute of Electrical and Electronics Engineers. Bhaumik's current interest is performing innovative research in deciphering the century old enigma of quantum physics as well as sharing with the public the advances in quantum physics and cosmology and their implications for our lives, work, technology, and spiritual development. This he endeavors to do through books such as the Code Name God and The Cosmic Detective, articles, lectures, and TV programs like the Cosmic Quantum Ray.
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This is even more critical for nanoscale systems where interfaces could significantly affect the properties relative to bulk materials. Low thermal resistance at interfaces is technologically important for applications where very high heat dissipation is necessary. This is of particular concern to the development of microelectronic semiconductor devices as defined by the International Technology Roadmap for Semiconductors in 2004 where an 8 nm feature size device is projected to generate up to 100000 W/cm2 and would need efficient heat dissipation of an anticipated die level heat flux of 1000 W/cm2 which is an order of magnitude higher than current devices. On the other hand, applications requiring good thermal isolation such as jet engine turbines would benefit from interfaces with high thermal resistance.
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Microfabrication technologies originate from the microelectronics industry, and the devices are usually made on silicon wafers even though glass, plastics and many other substrate are in use. Micromachining, semiconductor processing, microelectronic fabrication, semiconductor fabrication, MEMS fabrication and integrated circuit technology are terms used instead of microfabrication, but microfabrication is the broad general term. Traditional machining techniques such as electro-discharge machining, spark erosion machining, and laser drilling have been scaled from the millimeter size range to micrometer range, but they do not share the main idea of microelectronics-originated microfabrication: replication and parallel fabrication of hundreds or millions of identical structures. This parallelism is present in various imprint, casting and moulding techniques which have successfully been applied in the microregime.
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At present, the majority of connections to the silicon integrated circuit chip are made using thermosonic bondingHarman, G., Wire Bonding In Microelectronics, McGraw-Hill, Ch. 2, p. 36 because it employs lower bonding temperatures, forces and dwell times than thermocompression bonding, as well as lower vibratory energy levels and forces than ultrasonic bonding to form the required bond area. Therefore the use of thermosonic bonding eliminates damaging the relatively fragile silicon integrated circuit chip during the bonding cycle. The proven reliability of thermosonic bonding has made it the process of choice, since such potential failure modes could be costly whether they occur during the manufacturing stage or detected later, during an operational field-failure of a chip which had been connected inside a computer or a myriad of other microelectronic devices.
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In 1990, he graduated from the Moscow Aviation Institute, "Engineering and system analysis of microelectronic devices." The second education (unfinished) - lecture of Oriental Studies at the Institute of Asian and African (Moscow State University). In 1993–95 he worked as a teacher of the history of Russia and Western Europe in the first classical orthodox school "Radonezh-Yasnevo". Since 1987 he has worked in independent journalism as a special correspondent for the independent newspapers Messenger of Christian Democracy (1987–91), as the head the Society and Culture department of The First of September (1992–95), as the project author and executive editor of application "NG-religion" and special correspondent on "hot spots" of Nezavisimaya Gazeta (1995–02), and as the project author and editor of the magazine Meaning.
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RC oscillators are a type of feedback oscillator; they consist of an amplifying device, a transistor, vacuum tube, or op-amp, with some of its output energy fed back into its input through a network of resistors and capacitors, an RC network, to achieve positive feedback, causing it to generate an oscillating sinusoidal voltage. They are used to produce lower frequencies, mostly audio frequencies, in such applications as audio signal generators and electronic musical instruments. At radio frequencies, another type of feedback oscillator, the LC oscillator is used, but at frequencies below 100 kHz the size of the inductors and capacitors needed for the LC oscillator become cumbersome, and RC oscillators are used instead. Their lack of bulky inductors also makes them easier to integrate into microelectronic devices.
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It is a discipline because a body of knowledge is used to inform practitioners as to the most effective way to design the system within a set of constraints. A hardware architecture is primarily concerned with the internal electrical (and, more rarely, the mechanical) interfaces among the system's components or subsystems, and the interface between the system and its external environment, especially the devices operated by or the electronic displays viewed by a user. (This latter, special interface, is known as the computer human interface, AKA human computer interface, or HCI; formerly called the man-machine interface.) Integrated circuit (IC) designers are driving current technologies into innovative approaches for new products. Hence, multiple layers of active devices are being proposed as single chip, opening up opportunities for disruptive microelectronic, optoelectronic, and new microelectromechanical hardware implementation.
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At present, the majority of connections to the silicon integrated circuit chip are made using thermosonic bondingHarman, G., Wire Bonding In Microelectronics, McGraw-Hill, Ch. 2, p. 36 because it employs lower bonding temperatures, forces and dwell times than thermocompression bonding, as well as lower vibratory energy levels and forces than ultrasonic bonding to form the required bond area. Therefore, the use of thermosonic bonding eliminates damaging the relatively fragile silicon integrated circuit chip during the bonding cycle. The proven reliability of thermosonic bonding has made it the process of choice, since such potential failure modes could be costly whether they occur during the manufacturing stage or detected later, during an operational field-failure of a chip which had been connected inside a computer or a myriad of other microelectronic devices.
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3 Mar. 2016. Normal approach such as critical dimension- scanning electron microscopy (CD-SEM) to obtain data for pattern quality inspection takes too much time and is also labor-intensive. On the other hand, the optical scatterometer-based metrology is a non-invasive technique and has very high throughput due to its larger spot size. These results in the collection of more statistical data than by using SEM, and that data processing is also automated with the optical technique making it more feasible than traditional CD-SEM.Van Look, L., Rincon Delgadillo, P., Yu-tsung Lee, Pollentier, I., Gronheid, R., Yi Cao, Guanyang Lin, Nealey, P.F. “High Throughput Grating Qualification of Directed Self-Assembly Patterns using Optical Metrology.” Microelectronic Engineering 123 (2014): 175-179. ScienceDirect. Web. 3 Mar. 2016.
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Grandmont Campus (Sciences) - Building L Research at the University is at the forefront in the social sciences and humanities in the study of the Renaissance through the Graduate Center of the Renaissance since 1956 and in knowledge of food heritage through a program ambitious research at the Institute of European history and culture of food. The University of Tours is also distinguished in the field of materials for energy technology research with the Microelectronic at CERTEM in collaboration with ST Microelectronics in 1996. The research also extends into the field of medical imaging and bio-medicine, oncology, and eminently in the study of autism at the University Hospital of Tours. Geo-science and environment with the study of insects at the Institute for Research on the biology of the insect (IRBI).
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The signal delay of a wire or other circuit, measured as group delay or phase delay or the effective propagation delay of a digital transition, may be dominated by resistive-capacitive effects, depending on the distance and other parameters, or may alternatively be dominated by inductive, wave, and speed of light effects in other realms. Resistive-capacitive delay, or RC delay, hinders the further increasing of speed in microelectronic integrated circuits. When the feature size becomes smaller and smaller to increase the clock speed, the RC delay plays an increasingly important role. This delay can be reduced by replacing the aluminum conducting wire by copper, thus reducing the resistance; it can also be reduced by changing the interlayer dielectric (typically silicon dioxide) to low-dielectric-constant materials, thus reducing the capacitance.
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When the actual physical limits of the planet, in other words, seem to endanger technology, it finds a way to make the planet itself a device to be managed and sustained. The chapter and Part 2 end with a fascinating number of pages in which Borgmann tries to prognosticate on the topic of the upcoming (for him in 1984) “microelectronic revolution”—i.e., e.g., computers (148-153). The book has an admirably forward-looking sense of how big microelectronics will impact this entire issue, and ends by arguing—unsurprisingly—that they will be, however, “not revolutionary at all” “in another sense,” because they will only serve to further entrench the device paradigm. He thus ends by noting the need for “counterforces to technology,” the “focal practices” which will be the concern of Part 3 (153).
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The Mozhayets 5 was a Russian satellite launched on Thursday, 27 October 2005.Mozhayets Satellite Lost - Russian Commission, Moscow, Russia (SPX), Nov 08, 2005 Manufactured by AO Polyot and Mozhaisky Military Space Academy the satellite's purpose was to carry a set of scientific equipment for studying the effects of outer space factors on the operation of microelectronic devices and onboard computers. Shortly after launch telemetry fell silent as its Kosmos-3M class launch vehicle failed to separate from its third rocket stage and never reached an operational state. However, another satellite launched into orbit with Mozhayets-5 – the European Space Agency's (ESA) student-built SSETI Express spacecraft – was placed in a safe mode due to an undervoltage caused by battery charging problems, after reaching its own proper orbit.
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Electrically operated display devices have developed from electromechanical systems for display of text, up to all-electronic devices capable of full- motion 3D color graphic displays. Electromagnetic devices, using a solenoid coil to control a visible flag or flap, were the earliest type, and were used for text displays such as stock market prices and arrival/departure display times. The cathode ray tube was the workhorse of text and video display technology for several decades until being displaced by plasma, liquid crystal (LCD), and solid-state devices such as thin-film transistors (TFTs), LEDs and OLEDs. With the advent of metal-oxide-semiconductor field-effect transistors (MOSFETs), integrated circuit (IC) chips, microprocessors, and microelectronic devices, many more individual picture elements ("pixels") could be incorporated into one display device, allowing graphic displays and video.
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CISC Semiconductor GmbH defines itself as “design and consulting service company for industries developing embedded microelectronic systems with extremely short Time-To-Market cycles.” The company started in 1999, working on solutions for the semiconductor industry, but soon expanded its field towards the automotive branch and further extended business towards the radio frequency technology (RFID) sector in 2003. Since then, CISC gained significant experience and expertise in RFID, developing an own business segment and highly sensitive measurement equipment to test and verify RFID systems for different industries. Representatives of CISC Semiconductor are actively working on and contributing to worldwide standardization of future technologies like RFID, in different standardization organizations. This effort brings CISC into the position of being a leader in research and development, and thus being able to be “one step ahead of innovation”.
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The primary application of monocrystalline silicon is in the production of discrete components and integrated circuits. Ingots made by the Czochralski method are sliced into wafers about 0.75 mm thick and polished to obtain a regular, flat substrate, onto which microelectronic devices are built through various microfabrication processes, such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. A single continuous crystal is critical for electronics, since grain boundaries, impurities, and crystallographic defects can significantly impact the local electronic properties of the material, which in turn affects the functionality, performance, and reliability of semiconductor devices by interfering with their proper operation. For example, without crystalline perfection, it would be virtually impossible to build very large-scale integration (VLSI) devices, in which billionsPeter Clarke, Intel enters billion-transistor processor era, EE Times, 14 October 2005.
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Punit Boolchand is a materials scientist, a professor in the Department of Electrical Engineering and Computing Systems (EECS) in the College of Engineering and Applied Science (CEAS) at the University of Cincinnati (UC), where he is director of the Solid State Physics and Electronic Materials LaboratoryUniversity of Cincinnati He discovered the Intermediate Phase: an elastically percolative network glass distinguished from traditional (clustered) liquid–gas spinodals by strong non-local long-range interactions. The IP characterizes space-filling, nearly stress-free and non-aging, critically self-organized non-equilibrium glassy networks (such as window glass, ineluctably complex high-temperature superconductors, microelectronic Si/SiO2 high-k dielectric interfaces, and protein folding). His experimental data over a 25-year period (1982–2007) formed the basis for the theory of network glasses developed by James Charles Phillips and Michael Thorpe. The theory was adopted by Corning Inc.
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Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation (particle radiation and high-energy electromagnetic radiation), especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare. Most semiconductor electronic components are susceptible to radiation damage, and radiation-hardened components are based on their non-hardened equivalents, with some design and manufacturing variations that reduce the susceptibility to radiation damage. Due to the extensive development and testing required to produce a radiation-tolerant design of a microelectronic chip, radiation-hardened chips tend to lag behind the most recent developments. Radiation-hardened products are typically tested to one or more resultant effects tests, including total ionizing dose (TID), enhanced low dose rate effects (ELDRS), neutron and proton displacement damage, and single event effects.
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