The company's stacked silicon interconnect (SSI) technology stacks several (three or four) active FPGA dies side-by-side on a silicon interposer – a single piece of silicon that carries passive interconnect. The individual FPGA dies are conventional, and are flip-chip mounted by microbumps on to the interposer. The interposer provides direct interconnect between the FPGA dies, with no need for transceiver technologies such as high-speed SERDES.Clive Maxfield, EETimes.
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Each interposer also has a tab that slots in between loose steel balls in a race, the size of balls and race selected precisely to leave a total gap barely larger than the width of the interposer tab, such that only one interposer tab can fit in the free space and thus only one letter can be selected at a time. When the interposer is depressed, it engages a metal bar (cycle clutch latch link) that connects the clutch on the cycle shaft for one cycle, providing power to the filter shaft, whose lobes thrust the interposer towards the front (operator end) of the machine. When the interposer moves, each of its lugs engages one of a set of bars (selector bails) that run from left to right across the keyboard mechanism. In a machine with a North American keyboard, there are five "negative logic" selector bails (two for tilt and three for rotation), and one "positive logic" bail (called "minus five") for accessing characters in the opposite direction of rotation.
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A series of spring clutches power the cams which provide the motion needed to perform functions such as backspacing. When the typist presses a key, a pawl on the key lever depresses a matching metal bar (interposer) for that key. The interposer, which is oriented front to back in the machine, has one or more short projections (lugs) protruding from its bottom edge. Each interposer has a unique combination of lugs, corresponding to the binary code for the desired character.
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Pressing two keys several milliseconds apart allows the first interposer to enter the tube, tripping a clutch which rotated a fluted shaft driving the interposer horizontally and out of the tube. The powered horizontal motion of the interposer selected the appropriate rotate and tilt of the printhead for character selection, but also made way for the second interposer to enter the tube some milliseconds later, well before the first character had been printed. While a full print cycle was 65 milliseconds this filtering and storage feature allowed the typist to depress keys in a more random fashion and still print the characters in the sequence entered. The space bar, dash/underscore, index, backspace and line feed repeated when continually held down.
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2003: The machine had a feature called "Stroke Storage" that prevented two keys from being depressed simultaneously. When a key was depressed, an interposer, beneath the keylever, was pushed down into a slotted tube full of small metal balls (called the "compensator tube") and spring latched. These balls were adjusted to have enough horizontal space for only one interposer to enter at a time. (Mechanisms much like this were used in keyboards for teleprinters before World War II.) If a typist pressed two keys simultaneously both interposers were blocked from entering the tube.
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After the solder balls are used to attach an integrated circuit chip to a PCB, often the remaining air gap between them is underfilled with epoxy. "Underfill revisited: How a decades- old technique enables smaller, more durable PCBs". 2011\. "Underfill". In some cases, there may be multiple layers of solder balls -- for example, one layer of solder balls attaching a flip chip to an interposer to form a BGA package, and a second layer of solder balls attaching that interposer to the PCB. Often both layers are underfilled.
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After a character is struck onto the paper, the mechanism is reset, including replacing all latches on their bails and moving the interposer back into position. If the key that was pressed is still down at this time, the interposer rotates the keylever pawl out of the way to prevent key repeat until the key is released and depressed again, starting the next cycle. The complex Selectric system was highly dependent upon lubrication and adjustment, and much of IBM's revenue stream came from the sale of Service Contracts on the machines. Repair was fairly expensive, so maintenance contracts were an easy sell.
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The resulting package has no added length or width. Because no interposer is required, a TSV 3D package can also be flatter than an edge-wired 3D package. This TSV technique is sometimes also referred to as TSS (Through-Silicon Stacking or Thru-Silicon Stacking).
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3D Packaging refers to 3D integration schemes that rely on traditional methods of interconnect such as wire bonding and flip chip to achieve vertical stacks. 3D packaging can be disseminated further into 3D system in package (3D SiP) and 3D wafer level package (3D WLP), Stacked memory die interconnected with wire bonds, and package on package (PoP) configurations interconnected with either wire bonds, or flip chips are 3D SiPs that have been in mainstream manufacturing for some time and have a well established infrastructure. PoP is used for vertically integrating disparate technologies such as 3D WLP uses wafer level processes such as redistribution layers (RDL) and wafer bumping processes to form interconnects. 2.5D interposer is also a 3D WLP that interconnects die side- side on a silicon, glass or organic interposer using TSVs and RDL.
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In 2011, Xilinx began shipping sample quantities of the Virtex-7 2000T "3D FPGA", which combines four smaller FPGAs into a single package by placing them on a special silicon interconnection pad (called an interposer) to deliver 6.8 billion transistors in a single large chip. The interposer provides 10,000 data pathways between the individual FPGAs – roughly 10 to 100 times more than would usually be available on a board – to create a single FPGA. In 2012, using the same 3D technology, Xilinx introduced initial shipments of their Virtex-7 H580T FPGA, a heterogeneous device, so called because it comprises two FPGA dies and one 8-channel 28Gbit/s transceiver die in the same package. The Virtex-6 family is built on a 40 nm process for compute-intensive electronic systems, and the company claims it consumes 15 percent less power and has 15 percent improved performance over competing 40 nm FPGAs.
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Retrieved May 12, 2011. Following the introduction of its 28 nm 7-series FPGAs, Xilinx said that several of the highest-density parts in those FPGA product lines will be constructed using multiple dies in one package, employing technology developed for 3D construction and stacked-die assemblies. Xilinx's approach stacks several (three or four) active FPGA dies side by side on a silicon interposer – a single piece of silicon that carries passive interconnect.EDN Europe.
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The initial desktop Model 50 and Model 70 also featured a new cableless internal design, based on use of interposer circuit boards to link the internal drives to the planar (motherboard). Additionally these machines could be largely disassembled and reassembled for service without tools. Additionally, the PS/2 introduced a new software data area known as the Extended BIOS Data Area (EBDA). Its primary use was to add a new buffer area for the dedicated mouse port.
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The process has four levels of interconnect. While the P55C remained compatible with Socket 7, the voltage requirements for powering the chip differ from the standard Socket 7 specifications. Most motherboards manufactured for Socket 7 prior to the establishment of the P55C standard are not compliant with the dual voltage rail required for proper operation of this CPU (2.9 volt core voltage, 3.3 volt I/O voltage). Intel addressed the issue with OverDrive upgrade kits that featured an interposer with its own voltage regulation.
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Additionally, the resale value of Sprint-sold iPhones generally are the lowest of devices sold by the top four carriers in the country. Means to unlock a GSM-capable iPhone exist, such as using a SIM interposer, but the device may not function fully or correctly on the desired network, and unlocking of the device had been a violation of the law under the terms of the DMCA up until August 1, 2014, when President Obama signed into law a bill allowing the unlocking of cell phones.
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Another possibility is that Gazelem is not a proper name but a title for a seer. Thirdly, the name may be a reference to Joseph Smith, who was referred to in the D&C; as "Gazelam" when code names were used to conceal the identity of those referred to in the revelations. The following quotes are helpful. > The word Gazelem appears to have its roots in Gaz - a stone and Aleim, a > name of God as a revelator or interposer in the affairs of men.
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SX-Aurora TSUBASA is a successor to the NEC SX series and SUPER-UX, which are vector computer systems upon which the Earth Simulator supercomputer is based. Its hardware consists of x86 Linux hosts with vector engines (VEs) connected via PCI express (PCIe) interconnect. High memory bandwidth (0.75–1.2 TB/s), comes from eight cores and six HBM2 memory modules on a silicon interposer implemented in the form- factor of a PCIe card. Operating system functionality for the VE is offloaded to the VH and handled mainly by user space daemons running the VEOS.
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Depending on the clock frequency (1.4 or 1.6 GHz), each VE CPU has eight cores and a peak performance of 2.15 or 2.45 TFLOPS in double precision. The processor has the world's first implementation of six HBM2 modules on a Silicon interposer with a total of 24 or 48GB of high bandwidth memory. It is integrated in the form-factor of a standard full length, full height, double width PCIe card that is hosted by an x86_64 server, the Vector Host (VH). The server can host up to eight VEs, clusters VHs can scale to arbitrary number of nodes.
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After finishing half of the comic, ScreamerClauz instead decided to make a 3D animation and bought models from Cinema 4D's Interposer plugin to animate scenes on his computer and edit them with Adobe Premiere. He re-wrote the script a number of times and hired actress Ruby LaRocca and actors Joshua Michael Greene, Victor Bonacore, and Joey Smack. He told them to act 'over the top', and included a laugh track and other sound effects. After the first edit, he realized how off-putting the models and animation were and changed the score and dialogue, leaving it with "some weird bio-polar balance".
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A 3D package (System in Package, Chip Stack MCM, etc.) contains two or more chips (integrated circuits) stacked vertically so that they occupy less space and/or have greater connectivity. An alternate type of 3D package can be found in IBM's Silicon Carrier Packaging Technology, where ICs are not stacked but a carrier substrate containing TSVs is used to connect multiple ICs together in a package. In most 3D packages, the stacked chips are wired together along their edges; this edge wiring slightly increases the length and width of the package and usually requires an extra “interposer” layer between the chips. In some new 3D packages, TSVs replace edge wiring by creating vertical connections through the body of the chips.
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Visualizing via-first, via- middle and via-last TSVs Dictated by the manufacturing process, there exist three different types of TSVs: via-first TSVs are fabricated before the individual devices (transistors, capacitors, resistors, etc.) are patterned (front end of line, FEOL), via-middle TSVs are fabricated after the individual devices are patterned but before the metal layers (back-end-of-line, BEOL), and via-last TSVs are fabricated after (or during) the BEOL process. Via- middle TSVs are currently a popular option for advanced 3D ICs as well as for interposer stacks. TSVs through the front end of line (FEOL) have to be carefully accounted for during the EDA and manufacturing phases. That is because TSVs induce thermo-mechanical stress in the FEOL layer, thereby impacting the transistor behaviour.
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Nouns for people who are associated with intrusive behavior include snooper, interferer, interrupter, intruder, interposer, invader, intervener, intervenist, interventionist, pryer, stickybeak, gatecrasher, interloper, peeping tom, persona non grata, encroacher, backseat driver, kibitzer, meddler, nosy parker, marplot, gossipmonger and yenta. There are also some more derisive terms such as buttinsky or busybody.OneLook Dictionary Search retrieved 28 October 2013 Intrusiveness can come at the hands of a political administration where it may be described as a nanny state or mass surveillance, but can also be derived from oneself or by other individuals such as family members, friends, associates or strangers.Maximum Potential an American Possibility - Page 2, Richard Monts 2010Richard hanley, South Park and Philosophy: Bigger, Longer, and More Penetrating p 91, 2013 Such an occurrence may culminate into feelings of embarrassment.
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AMD Fiji, the first GPU to use HBM The development of High Bandwidth Memory began at AMD in 2008 to solve the problem of ever-increasing power usage and form factor of computer memory. Over the next several years, AMD developed procedures to solve die- stacking problems with a team led by Senior AMD Fellow Bryan Black.High- Bandwidth Memory (HBM) from AMD: Making Beautiful Memory, AMD To help AMD realize their vision of HBM, they enlisted partners from the memory industry, particularly Korean company SK Hynix, which had prior experience with 3D-stacked memory, as well as partners from the interposer industry (Taiwanese company UMC) and packaging industry (Amkor Technology and ASE). The development of HBM was completed in 2013, when SK Hynix built the first HBM memory chip.
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A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through- silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global (package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); monolithic 3D ICs; 3D heterogeneous integration; and 3D systems integration.
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During development, Intel had changed the design specification, causing various compatibility and performance problems with some boards that were previously fully compatible. For instance, the Packard Bell 450 motherboard required a specially-designed interposer to be installed between the processor and the motherboard to cope with the changed specification, with the unfortunate consequence of precluding access to the motherboard's level 2 cache, resulting in sub-par performance.UKT Support page for the Packard Bell 450 motherboard In addition, some older chipsets do not support the write-back functionality of the chip's level 1 cache, which could also reduce performance. However, the majority of Socket 3 motherboards, particularly later (post-1994) VLB and most PCI boards, provide proper support for the Pentium OverDrive including fully operational access to the level 2 cache, and many earlier boards also support the processor with varying levels of compatibility and performance.
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Once VirtualGL is preloaded into a Unix or Linux OpenGL application, it intercepts the GLX function calls from the application and rewrites them such that the corresponding GLX commands are sent to the application server's X display (the "3D X Server"), which presumably has a 3D hardware accelerator attached. Thus, VirtualGL prevents GLX commands from being sent over the network to the user's X display or to a virtual X display ("X proxy"), such as VNC, that does not support GLX. In the process of rewriting the GLX calls, VirtualGL also redirects the OpenGL rendering into off-screen pixel buffers ("Pbuffers.") Meanwhile, the rest of the function calls from the application, including the ordinary X11 commands used to draw the application's user interface, are allowed to pass through VirtualGL without modification. Internally, VirtualGL's interposer engine also maintains a map of windows to Pbuffers, matches visual attributes between the destination X display (the "2D X Server") and the 3D X Server, and performs a variety of other hashing functions to assure that the GLX redirection is seamless.
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